InvestPenang yesterday organised a closed-door Advanced Packaging & Penang Automation, Test and Equipment (ATE) Campus Collaboration Workshop, bringing together nine multinational corporations (MNCs) in the advanced packaging sector - Intel, Microsoft, TF AMD, ASE, Analog Devices, AT&S, Chipbond, Wafertek and Inari Amertron, together with twelve pre-qualified local ATE companies to explore potential collaboration opportunities.
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