Micro Modular System Sdn Bhd

Micro Modular System Sdn. Bhd.

13 May 2026

At a Glance

Principal Activit(ies):
  • Industrial Automation & Equipment Solutions Provider
  • Vision Inspection & Test Systems for Advanced Manufacturing
  • Custom Machine Engineering & System Integration
Location(s): Bayan Lepas, Penang, Malaysia
Number of employees: 130+
Manufacturing Floorspace: > 90,000 sq. ft. (Built-up area: > 55,000 sq. ft.)
Core Competency(ies):
  • Customised Automation Solutions
  • End-to-End OEM & ODM Manufacturing
  • Advanced AOI & High-Precision Machine Vision Systems
  • Electrical & Optical Testing Solutions
  • Intelligent Production Line Automation
  • Inline Quality Control & Process Monitoring
Revenue: RM34 million (2025)
Certification (s): ISO 9001:2015 (SGS Certified)
Website: https://mmsis.com/
Contact Person: Ms. Kim LS
Email: ls_kim@mmsis.com

 

Introduction

Established in 1997, Micro Modular System (MMS) is a Penang-based industrial automation specialist operating from a 90,000 sq. ft. facility with a workforce of over 130 skilled professionals. MMS designs and manufacture custom-built automation systems that deliver high-speed, high-precision testing, inspection, and material handling solutions for global manufacturers.

Serving industries including semiconductor, automotive, smart devices, and medical technology, MMS is driven by engineering excellence, innovation, and long-term sustainability. Today, the company’s solutions are deployed worldwide across the United States, Canada, Europe, Australia, and Asia.

MMS possesses deep expertise in handling diverse semiconductor and electronic components, including wafers, LED arrays, substrates, flex circuits, lead frames, lenses, and batteries. The company’s modular automation platforms are designed with configurable input and output architectures, enabling the integration of multiple process-critical functions into fully customised end-to-end manufacturing systems tailored to each product type.

Products & Services

 

Product Description
vWW900
Auto Focus
Wafer Inspection
The vWW900 is a high-precision automated platform for defect inspection of 4″ to 12″ wafers. Featuring a 25MP vision system and a 4-objective lenses turret, it achieves ±2µm accuracy while detecting scratches, cracks, and contamination. Equipped with an advanced vision aligner and a minimum-contact vacuum stage with a configurable intelligent multi-axis (xyzθ) stage, it ensures the gentle handling of delicate wafers. With dual-arm robotics and modular cassette configurations, the vWW900 provides a high-reliability solution for semiconductor and LED manufacturing.
mWW600
Intelli-AI Die Sorter
The mWW600 is an automated sorting system with flexible input & output for semiconductor and LED manufacturing. It supports die sizes ranging from 1mm to 5mm and thickness down to 0.04mm using an enhanced ejector design. Equipped with comprehensive 6-sided vision inspection, the system performs cosmetic and automated XY correction. Featuring versatile 6″ to 12″ wafer input and multiple output options like tape & reel or bin, the mWW600 delivers precise handling and improved production efficiency.
vSA100
Intelli-AI Robot Arm
Vision Inspection
The vSA100 is a versatile 6-axis robot arm system designed for automated multi-point inspection of complex assemblies with hard-to-reach planes. Equipped with a 9MP camera and motorised lenses, it delivers comprehensive 6-sided (6S) inspection with ~0.1mm accuracy. The platform utilises an in-house AI vision system for advanced tasks like OCR/OCV, code reading, and connector pin analysis. Featuring variable lighting and a customisable stage, the vSA100 offers a highly adaptable solution for the semiconductor, automotive, and electronics industries.
WI300
Intelli-AI Wire bond
Inspection Machine
The WI300 is a high-precision automated vision system for wire bond quality assurance on LEDs, lenses, and IC packages on 4” to 6” wafers. Using 5MP to 65MP camera technology and confocal sensors, it performs critical height compensation and warpage detection up to 2mm. The platform provides comprehensive inspection for wire sweep, bond offset, and cosmetic die defects at throughputs up to 20K UPH. With real-time wafer mapping and auto-alignment, the WI300 delivers a versatile, high-performance solution for semiconductor fabrication environments.
iRR300
Intelli-AI Flex Circuits
Integrated Handler
The iRR300 is a versatile “5-in-1” reel-to-reel platform that integrates code reading, electrical testing, AI-powered vision inspection, and precision punching for LED flex circuits. Utilising 16K line scan cameras and 3D profilers, it provides comprehensive top and bottom inspection with ±18µm accuracy and throughputs up to 5,500 UPH. The system identifies various defects, including electrical shorts, bent leads, and polyimide surface flaws. With optional laser marking and a compact footprint, the iRR300 delivers a high-efficiency solution for demanding flex circuit manufacturing.
LF1000
Auto Trim & Form
Singulation Machine
Fully automated singulation system for lead frames, powered by a high-performance 3-to-5 ton servo-driven press for precise cutting and forming. It features a modular SMED die set for rapid product conversion and supports speeds from 80 to 120 SPM. Equipped with automatic magazine handling and tube changers, the LF1000 also offers optional integrated lead inspection to ensure high-quality standards in semiconductor assembly environments.
TV200
Intelli-AI
Test & Vision Inspection
The TV200 is a high-efficiency 2-in-1 platform that integrates comprehensive testing and vision inspection for sensitive devices like LED flash lenses and photo sensors. Utilising an intelligent micro-alignment station for precise theta correction, it performs optical, electrical, uniformity, and photodiode tests alongside 6-sided vision inspection. The system achieves a throughput of 3,500 UPH and offers flexible output options, including tray magazines or tape and reel. With specialised stations for parameters like luminous flux and spectral wavelength, the TV200 provides a versatile, error-free solution for semiconductor manufacturing.
VN200
Test Handler
The VN200 is a high-speed rotary turret test handler designed for automated testing and packaging of semiconductor components like QFN, SOT, and SOIC. The system features a 20 or 24-finger configuration with four parallel test sites and optional laser marking. Its integrated vision system uses top and 4S cameras to deliver 12µm precision for lead integrity, co-planarity, and cosmetic defect inspection. With servo-driven indexing and versatile tube or tape & reel output options, the VN200 provides a flexible, high-efficiency solution for high-volume manufacturing environments.
BBQ00
Burn-In Test Chamber
The bBQ00 is a customisable environmental stress testing platform for high-reliability components like LEDs, MOSFETs, and batteries. Managed by proprietary BURNNET software, it provides real-time monitoring and data analysis across a temperature range of -20°C to 150°C. The system uses in-house multi-layer boards and package-specific sockets to ensure consistent electrical contact. With adaptable heating and cooling rates, the bBQ00 offers a scalable, high-efficiency solution for demanding semiconductor and automotive burn-in processes.
VI500
Intelli-AI Glass Turret
AOI Machine
The VI500 is a high-speed 6 sided vision system for automated inspection of small parts like LEDs and connectors. Fed via vibrator bowl onto a glass platform, it performs “on-the-fly” inspections at up to 70,000 UPH. The system provides comprehensive six-sided defect detection with real-time monitoring and dual-image acquisition. Featuring automated sorting, the VI500 ensures high-efficiency production and rapid product conversion.

Future Plan

As AI reshapes global industries and Malaysia emerges as a key hub for data center expansion, MMS is strategically positioning itself to support AI-related manufacturing, high-reliability components, and next-generation digital infrastructure.

1. Advanced Packaging

With decades of experience in semiconductor automation, MMS is expanding into advanced packaging technologies to support AI-driven chip manufacturing. MMS is actively analysing high-impact process nodes within advanced packaging workflows to identify automation, inspection, and testing opportunities that enhance yield, precision, and reliability

   

An analysis of advanced packaging chip production processes to identify high-impact application points

 

2. Batteries

MMS is advancing its capabilities in battery manufacturing automation, covering consumer electronics batteries to high-capacity customised systems for data centers and electric vehicles. The company’s focus areas include robotic precision handling, laser marking, automated burn-in testing, and reliability validation systems tailored for high-performance energy storage applications.

         

Laser marking with reliability testing and burn-in test chambers customised for battery testing

 

3. Electric Vehicles

Leveraging the company’s proven experience in vision inspection and component testing for the automotive industry, MMS is expanding its automation expertise to support EV manufacturing. The company’s solutions integrate robotic handling, machine vision inspection, battery testing, and high-reliability component validation to meet the evolving demands of electric mobility.

         

Integrated automation solutions for testing and machine vision inspection of automotive LED bulbs

 

4. Medtech

MMS expands its medtech capabilities through ongoing innovation across key processes, including material handling, assembly, and quality control systems, reducing operator dependency while ensuring audit-ready compliance throughout the production lifecycle, from process execution to final validation.

      

Process-critical sterile sealing process (CSP)  solutions with cobot automation and integrated quality verification

 

Written in March 2026

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