Local INsights, Machinery & Equipment

Mi Equipment (M) Sdn. Bhd.

2 September 2024 | by |
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Mi Equipment (M) Sdn. Bhd.

2 September 2024

At a Glance

Principal Activit(ies): Manufacture of semiconductor assembly
Location(s): Local operation site: Bayan Lepas, Penang, Malaysia

Other operation sites: Suzhou City (China), Pyeongtaek City (Korea)

Sales & service offices: Singapore, Taiwan, US
Number of employees: Over 300 employees worldwide
Manufacturing Floorspace: Over 118,000 sq. ft. in total
Core Competency(ies):
  • AI-enabled wafer-level advanced packaging and die sorting machines
  • Smart multiple bin sorting platform
  • Laser compression bonder (LCB) and laser assisted bonding (LAB)
  • High temperature Known Good Die (KGD) and packaged test handler
  • Vision inspection and taping equipment
Revenue: RM174 million (2023)
Certification (s): ISO9001
Website: https://www.mi-eq.com/
Contact Person: Annie Saw
Email: sales@mi-eq.com

 

Introduction

Founded in 2012, Mi Equipment (M) Sdn Bhd has established itself as a leading player in the semiconductor equipment market. The company’s commitment to technology advancements and continuous innovation has enabled it to deliver cutting-edge solutions that meet the evolving needs of the semiconductor industry.

Mi Equipment offers a wide range of products that cater to different stages of the semiconductor backend process. This includes die sorter, smart multiple binning, die bonders, final test handlers, and vision inspection; providing equipment and process solutions for mobility & wearables, HPC & memory, automotives & renewable energy industries. These products incorporate state-of-the-art technologies such as artificial intelligence (AI), machine learning, vision, and automation to optimise manufacturing efficiency and improve on product quality.

With a strong emphasis on research and development, Mi Equipment has a dedicated team of engineers and specialists who continuously work on developing innovative solutions and advancing the capabilities of their equipment. The company’s commitment to quality and customer satisfaction has earned its reputation for delivering reliable and high-performance semiconductor backend solutions.

Mi Equipment operates in a global market, serving customers in various regions including Asia, North and Central America, and more. The company’s customer base includes semiconductor manufacturers, integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) companies, and other entities involved in the semiconductor industry.

 

Products & Service

1. Automotive & Renewable Energy Solutions

Known Good Die (KGD) Test Handler

Si Series
  • Known Good Die concept – Only good device in the output reel
  • Double sided SiC KGD and Single sided Si KGD
  • High temperature, high current and voltage testing available
  • Tester solutions available
  • Test site with XY compensation – removes the need of socket guide plate, eliminating associated die crack risk
  • Final Test done at last station of the process flow
  • Advanced AOI
  • Dynamic Laser Marking only on good device
  • Detaping for Rework and Retest
  • Besides film frame to tape & reel format, other format available
  • Market Leading Platform

 

Smart Multiple Bin Sorter

Mi Series

 
  • For SiC post KGD Multiple Bin Sorting
  • Market leading UPH
  • Wafer Input to Multiple Tape and Reel
  • 4 to 8 TnR available
  • Advanced AOI incorporated
  • Detaper available to TnR or wafer

 

 
Power Module Test Handler

Si Series
  • Tube input and output
  • Tray format available
  • Suitable for high voltage / high current application
  • High temperature testing available
  • Incorporate laser marking and 2DID platform
  • AOI available
  • Complete solutions with tester available

 

 

 

2. HPC & Memory Solution

Die Sort with Smart Binning & Advanced AOI

Mi28W Wafer to Wafer

Mi18 Wafer to Waffle Pack

 
  • Solution to Multi Bin sorting – Every bin counts
  • Up to 38 bins Sorting for waffle pack output
  • Both models suited to address customer’s next process and control needs – sort the multi bins to wafer or waffle pack
  • Equipped with 6 Side AOI

 

 

Compression Laser Assisted Bonding

ZLAB & LAB

 
  • ZLAB is LAB with Added Bond Force Control
  • Direct integrates into existing FC bonder line
  • Unparallel performance for warpage sensitive package and narrow pitch device
  • LAB a great option for narrow pitched FCCSP/ SIP application

Fully Integrated Precision Laser Compression Bonder

LCB

 
  • Enabling Technology for Large Body Size, Warpage Sensitive, Narrow Pitched Packages
  • Better warpage tolerance – up to 400um
  • Wafer/ Waffle Pack Input
  • Integrated Flux Dipping – Die Placement – Laser Bond – All in One
  • Localised heating with built-in Bonding Force and Height Control
  • Uniform device temperature ensures good bonding

 

 
Strip/ Boat based Inspection

Vi20S
  • Infra-red inspection on die back to check for cracks
  • Mi proprietary smart vision MiND.X option available for self-learning capability
  • Effectively reduce dependency on human eyes for decision
  • Optical inspection available
  • Ensure process compliance

 

 

 

3. Mobility & Wearables EMI Shielding Solutions

High Speed Attach (Pre-EMI Sputtering)

Mi10 Series

 
  • Tray or Film Frame Input
  • Flip option available upon request
  • Market Leading UPH
  • Coupled with Pressing Module to meet bond force
  • Equipped with 6 Side AOI
  • Wide device size range

Detach & AOI (Post-EMI Sputtering)

Mi28 Series

 

 
  • Various output available: Tray, Tape & Reel or Both
  • Wafer output also available upon request
  • Flip option available upon request
  • Market Leading UPH
  • Patented Cleaning Module to serve high efficiency and high-quality de-burring
  • Equipped with 6 side EMI level AOI
  • Wide device size range
  • Market leader in <3x3mm segment

Test Handler with Integrated AOI

Si Series

 

 
  • Jedec Tray input and Tape & Reel output
  • Prevent scratches on EMI with WLCSP certified handling & alignment
  • Multiple Test Sites
  • Equipped with EMI level 6 side AOI – Test and AOI All in One for COO savings
  • Infra-Red and 3D vision available as option
  • Reject tray available
  • De-taper available upon request
  • Pure AOI handler (without test sites) available too

 

 

 

 

4. Mobility & Wearables Sensor & Display Solutions

Smart Multi-Bin Sorting

Mi Series
  • Wafer to Wafer Platform
  • Design to enable Multiple Bin Sorting – up to 10 bins
  • Multiple Output Cassettes format to cater for multiple bin sorting efficiency
  • 6S Advanced Sensor and Display level AOI available
  • Industrial Automation ready – incorporating auto wafer cassette handling
  • Thin die capability
  • Class 100

 

 
ALS/ ToF Test Handler

Si Series

 
  • Design to enable Sensor Testing with external stimuli.
  • Multiple types of stimulus test (e.g.  white light, proximity, cross-talk) available at one go, with one pick and place to improve testing reliability & capability and improve output efficiency
  • Multi-test configuration available
  • High UPH
  • Tray input – protect sensor.  Bowl feed input as option
  • Tape and reel output, with reject bin and tray
  • 6 Sides inspection available with Sensor inspection as option
  • High Temperature option available

 

 

 

5. Mobility & Wearables WLCSP Solutions

MiND.X (AI) Enabled Die Sorter

Mi Quantum and Quantum Plus
  • Most Advanced AI and Industrial 4.0 Driven Platform
  • Market Leading UPH > 50K UPH
  • MiND.X enabled Vision Platform – Reduce Overkill & Underkill
  • 9S AOI – 6S Optical + Sidewall IR, Backside IR and Latest Laser Groove IR AOI (available in Quantum Plus Platform)
  • Most Flexible platform – with Dual Track, De-taper options
  • Industrial 4.0 Automation Available with Auto Cassette and Auto Reel Change Platform – One of its Kind
  • Fast Conversion, Poka-yoke and Self Diagnostics Health Check Platform

 

 
Reel to Reel IR Inspection

Vi Series
  • Reel to Reel IR inspection
  • High UPH
  • MiND.X upgradeable to extend inspection capability
  • Most reliable QC and RMA platform
  • Optical Inspection included to complete multi-faceted inspections

 

 

 

Future Plan

Mi Equipment aims to adopt and enhance AI technology in their machine platforms, to improve their client’s cost of ownership and operability.

The company is also embracing Industrial 4.0 factory automation with end-to-end solutions.

Furthermore, Mi Equipment aims contributes to the industry with innovative solutions, such as laser bonding and smart binning.

 

Achievements & Awards

2023

  1. Industry Excellence Platinum Award by The Institution of Engineering and Technology
  2. Outstanding supplier by SJ Semiconductor (Jiangyin) Corp
  3. Top Semiconductor Manufacturing Solutions Provider by Semiconductor Review

 

2022-2024

  1. Penang Green Office Certification by PGC
  2. Sustainable Water Management Certification by PBA (Perbadanan Bekalan Air Pulau Pinang Sdn Bhd)

 

2021

  1. Certificate of Recognition (Supplier Award) by TF AMD

 

2020

  1. Best Supplier of Equipment by ASE Group

 

2017-2019

  1. Outstanding Supplier by ASE Group
  2. Supplier Partnership Award by Unisem
  3. Family Award (Outstanding Support) by ASE Chung Li

 

Written in August 2024
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