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March 4, 2026

[Press Release] Hanic Propels Malaysia’s Semiconductor Value Chain with New IC Design and Advanced Packaging Hub in Penang

Hanic, a rising leader in semiconductor technology with headquarter in Singapore, today announced a strategic expansion in Penang, Malaysia, to establish a state-of-the-art center for Integrated Circuit (IC) Design and Advanced Packaging Design.
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Thu

March ‘25

[Press Release] Meridian Adhesives Group Expands Technical Capabilities in Asia with the Launch of the Penang Application Development Center

19

Wed

March ‘25

The State of the Nation: Shot in the arm for producing Malaysian-made semiconductor chip

06

Thu

March ‘25

[Press Release] WOU Partners with TT Vision, Oppstar, and Clarion Malaysia to Strengthen Penang’s Semiconductor and Manufacturing Talent Pipeline

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Wed

March ‘25

SoftBank’s Arm to Drive Malaysia’s $270 Billion Chip Goals

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Sun

February ‘25

[Press Release] Investment Promotion Mission to Japan

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Wed

February ‘25

[Press Release] Investment Promotion Mission to Japan
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