TOPPAN brings advanced packaging capabilities spanning MPW, mass production and high-mix, low-volume requirements, supported by access to foundry partners including TSMC and VCA. As an Arm Approved Design Partner (AADP), TOPPAN contributes expertise in SoC and analog IP.

I-Tronics strengthens the ecosystem with front-end capabilities across semiconductor packaging design, assembly, testing and supply chain sourcing. Its expertise includes PCB/flexible PCB design, microelectronic packaging, wafer‑level technologies (WLCSP, FOWLP), RDL interposers, and emerging 2.5D/3D integration (e.g., CoWoS).

With these new additions, PSD@5KM+ now brings together 20 technology collaborators, enhancing the ecosystem’s capabilities and creating a more connected support ecosystem for the local IC design companies.