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At a Glance
| Principal Activit(ies): | Automated Optical Machine Manufacturer |
| Location(s): | 54 & 56, Jalan Industri Beringin, Taman Perindustrian Ringan Juru, 14100 Simpang Ampat, Pulau Pinang |
| Number of employees: | 40 – 50 |
| Manufacturing Floorspace: | 17,000 sq.ft. (Current) > 45,000 sq.ft. |
| Core Competency(ies): |
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| Revenue: | USD5 million (2025) |
| Certification (s): | ISO 9001:2015 |
| Website: | acavision.com.my |
| Contact Person: | Cs Cheam Email: cscheam@acavision.com.my |
Introduction
ACA, established in 2003, is a technology-driven company specialising in advanced machine vision and automated inspection solutions for the semiconductor and electronics industry.
With over two decades of experience, ACA has developed strong expertise in system integration, delivering customised, high-precision equipment tailored to diverse manufacturing requirements. By combining vision systems, mechanical design, and software development, the company provides end-to-end solutions that enhance product quality, improve operational efficiency, and drive higher yield and reliability.
Products & Services
AWB Series – Wirebond AOI Machine
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Stationery camera station with high speed and high accuracy vision inspection system which support multiple package and type. Handler is designed with double shutter in order to achieve higher output. Automated conveyor system is used to transport multiple magazines rack horizontally. Gripper system is used to hold and lift magazine racks precisely to pusher station. Pusher is loaded with spring to prevent jam occurs. Laser sensor is installed to detect the presence or absence of frame is in position. Shutter moves in X & Y axis for vision inspection. Clamper is used to reduce the warping of the frame |
AQN Series – Wafer AOI Machine (GEN II)
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This system is an advanced wafer handling and inspection solution designed to support both 8-inch and 12-inch wafer applications. It is compatible with FOUP/FOUB configurations, enabling seamless integration into semiconductor manufacturing environments.
The system is equipped with a high-precision wafer robot handling mechanism, ensuring accurate and reliable wafer transfer throughout the process. It is capable of handling both standard wafers and frame-mounted wafers, providing flexibility to accommodate various process requirements In addition, the system features on-the-fly scanning capability, allowing real-time inspection during wafer movement. This enhances throughput while maintaining high inspection accuracy, making it ideal for high-volume production environments. |
AT2T Series – Tray To Tray AOI Machine
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A stationary 5 sides camera station (supports up to 11 cameras) and movable top camera station with high speed and high accuracy vision inspection system which support multiple package and type. Handler is designed with 28 picker head in order to provide higher output. It also features auto pitching for multiple tray pitching, tray stacker system, shuttle system, sorting system & axis inspection. |
AQN Series – Wafer AOI Machine (GEN I)
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This is a high speed and high accuracy vision inspection system which provides mapping view and information. Its front pusher is installed with laser sensor to detect the absence and presence of the frame. Its shutter is equipped with pneumatic clamper/Vacuum chuck and moves in X & Y axis for vision inspection. Vacuum sensor is installed in gripper system to detect frame slippage. It contains inking system to do marking on defect unit for ease of traceability. The frame will then be transfer back to the magazine after vision inspection and inking for defect unit. |
AMB Series – Inline Post Wire AOI
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Stationary camera station with high speed and high accuracy vision inspection system which support multiple package and type. Handler is designed with single shuttle only. Pusher is loaded with spring to prevent jam occurs and transfer the product in the machine. Shutter is equipped with built-in jig and index hold sensor to track frame alignment to ensure frame is in position. Shutter moves in X & Y axis for vision inspection. Clamper is used to reduce the warping of the frame. |
ALH Series – Laser Mark AOI Machine
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The ALH Series – Laser Mark AOI Machine is an integrated solution designed to combine laser marking and automated optical inspection (AOI) within a single platform. By integrating with a laser marking system, the machine enables seamless processing from marking to inspection, improving overall production efficiency. The system features a precision track mechanism that transfers products smoothly between the laser marking station and the AOI station, ensuring stable and consistent operation. It is equipped with a reliable pick-and-place (P&P) handling system for accurate product loading and unloading. To further enhance process stability, the machine incorporates a clamper mechanism that minimises product warpage during both laser marking and inspection. This ensures consistent marking quality and accurate inspection results, making the ALH Series suitable for high-precision manufacturing environments. |
ATR Series – Turret AOI Machine
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The Turret AOI System is an advanced automated optical inspection machine designed for high-efficiency inspection and sorting operations. It is equipped with a dual tube stacker system, significantly increasing the loading and unloading capacity to support continuous high-volume production.
The system incorporates a multi-sorter reject mechanism, allowing flexible and efficient classification of inspected products based on quality results. This enhances sorting accuracy and improves downstream process handling. In addition, the machine features all-side inspection capability, ensuring comprehensive inspection coverage for each unit. This allows for more reliable defect detection and improved product quality assurance in high-precision manufacturing environments. |
ATT Series – Tube to Tube AOI Machine
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The Tube-to-Tube AOI Machine is an automated optical inspection system designed for efficient tube-based component handling and inspection. It features a gravity fall loading and unloading system, enabling smooth, stable, and low-maintenance product transfer into and out of the machine.
The system is equipped with a precision pick-and-place (P&P) handling mechanism, ensuring accurate and consistent component transfer during the inspection process. This design supports stable positioning, reliable inspection performance, and efficient high-volume production. |
AMD Series – Post Mold AOI Machine
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A high-speed vision inspection handler for post mold packages which provides top and bottom surface inspection. This handler is integrated with two insulation tester with reject magazine sorting. Dual magazine on loader and unloader to achieve zero stop time while exchange magazine. Post inspection lead punch and post-punch inspection are equipped in this handler. |
APS Series – Post Seal Reel to Reel AOI Machine
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The handler is installed with automated purging system for auto re-test function. This high speed and high accuracy vision inspection system able to support varies of pocket width. The conversion method is easy by simply remove the pin locator and adjust to desire pocket width. An indexer is used on track for more precise pocket position movement. The detected defect unit will be moved to automated sticker for verification. This handler is designed with 2 tracks to save operator’s handling time. It comes with built-in calibration jig for easy calibration. |
Vision Integration
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Front / Middle of Line Semiconductor
Processes:
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End of Line Semiconductor
Processes:
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Other Industries
Processes:
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Our Features
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Centralise Remote System
CRS use to allows access and control multiple devices from a single interface, making it easier to perform updates, troubleshoot issues and manage resources across multiple devices. |
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SECS/GEM
SECS/GEM is a communication protocol used in the semiconductor industry for standardised communication between equipment and host systems. |
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E-Mapping
E-Mapping use to verify the effectiveness of process changes or modifications, screen new materials or processes for potential failure modes, and ensure the quality and reliability of the semiconductors devices. |
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Wrong Die Pick Detection
Wrong die pick detection will ensure that the right die is picked and placed accurately, improving the quality of the final product and increasing overall efficiency in the manufacturing process. |
Future Plan
ACA’s future plan focuses on expanding production capacity, developing a smart factory ecosystem, and upgrading manufacturing environment to support high-volume, high-precision production.Key direction includes:
- Factory expansion (17,000 ft² → 45,000 ft²)
- Capacity increase (10 → 100 units/month)
- Smart automation (AGV, AI security, drone monitoring)
- Cleanroom & X-ray facility enhancement
- Ergonomic and digital factory transformation
Achievements & Awards
- Renesas PZ2.KD Engineering Partners Award 2025
- ASE Malaysia Supplier Appreciation Award 2022
- Existech Recognition for Outstanding service and Contribution 2015
- ISO 9001 Certified
Written in April 2026
Disclaimer:
Every effort is made to provide accurate and complete information in this article. However, InvestPenang makes no claims, promises or guarantees about the accuracy, completeness, or adequacy of the contents and expressly disclaims liability for errors and omissions of this article.
