EA630: Curing and Cooling Robotic System

EA630 is a robotic handling system coupled with curing ovens and cooling chambers for 3D-LED silicone strip molding process, for Automotive tail lamps and front/side marker flexible LED modules.

This system consists of 15 heating ovens and 15 cooling chambers, each independently controllable in its heating and cooling profile with feedback thermocouples and IR sensors to monitor and control chillers and associated heating elements.

Input and output molds are fed to the robot via a conveyor system. Robot places each mold into an oven for a predetermined time and removed to a cooling chamber to achieve desired cooling profile before removing units from the mold.

EA940 is the latest generation of tester, to test LED Matrix headlamp illumination module of new generation vehicles.

This tester is equipped with sophisticated electronics and sensors capable of testing each of the 84 addressable high powered LEDs independently for its electrical (Vf, Vr, If, I- leakage) and optical parameters (Intensity, colour).

As a module, this system is also able to communicate via CAN bus to command and test pixel cross-talk, pixel-bleed, pixel uniformity (intensity and colour).

System includes auto-loader, auto-unloader, auto-binning, software-bin/map-generation

EA930 is custom designed tester to test flexible silicone molded 3D-LEDs which can be contoured to form part of automotive tail lamps and side/front markers. There are up to 50 addressable LEDs in each strip.

The system has sophisticated sensors to detect optical parameters such as colour and intensity of each LED pixel, pixel cross-talk and ghosting, overall pixel uniformity, intensity and colour.

As a module, this system is also able to communicate via CAN bus to command and test pixel cross-talk, pixel-bleed, pixel uniformity (intensity and colour).

System includes auto-loader, auto-unloader, auto-binning, software-bin/map-generation

EA360 : PTMCL Burn-In System Controller

EA360 is an active burn-in chamber for micro-LED or IC modules burn-in. Each chamber can burn-in and simultaneously stress and test 36 micro-LED or IC modules at a time

Heating element and gases N2 is used to achieve the desired temperature ramps.

For micro-LED testing, the system continually writes and reads (via UART, I2C, SPI) while integrated source drivers electrically test each of the 20,000 pixels on each of the micro-LED module during the entire burn-in cycle.

For IC testing, the system continually writes and reads (via UART, I2C, SPI or custom serial bus) while integrated source drivers electrically test each electrical parameters (I, V, leakage, logic and delays) during the entire burn-in cycle.

EA508 : Auto Phosphor Wafer Tester with integrated AI-AVI Vision Engine

EA508 is an integration of two basic systems

A)     Auto Phosphor Wafer Tester

B)     AI-AVI Vision inspection system

This machine tests phosphor wafers (each about 30mm x 30mm x 50um) by exposing the wafer to different known wavelength light source of different intensity, while detecting the phosphor excited emission (colour and intensity).

Lasers are used to measures the thickness of each wafer, and AVI system performs vision inspection to detect contamination, blemish, cracks, chips and decides based on AI teaching, how to bin of each wafer.

System comes with an auto-loader, auto-unloader, pick & place system, sophisticated laser light sources and precision detector/sensors for precise measurements.

EA508 is also equipped with an AI teaching system, whereby images of various defects are collected and taught to the AI engine periodically, in order to continually improve the AVI phosphor tile inspection and binning process.

EA150 is an electroluminescence and electrical tester for the LED industry, particularly in the Die Preparation process.

Each partially completed die on the wafer is subjected to an electrical stimulus and its electroluminescence is measured by sensitive 2D arrays (on-axis and off-axis) to detect abnormalities, such as uneven uniformity, dark spots with no emission or low emission.

Based on results from the electroluminescence measured, each die will be binned accordingly.

Machine includes auto-top and/or bottom side probing, auto-loader/unloader for wafers in carriers, generates e-bin maps

EA830 is a high speed tile tester to test IC or LEDs mounted on a 100mm or 150mm square tile.

The system can achieve high speed as it has 4 sets of independently movable probes to index and probe, in which it can overlap index-time with test-time to save cost. Using this concept, one SMU can be used to test 2 devices by switching away from the moving probe to the probe-in-test-position.

System has build-in heater to pre-heat for hot-tile testing, with auto-loader and auto-unloader.

For LED testing, system incorporates an integrating sphere for light intensity measurement, and can test up to 4-times faster compared to conventional LED tester.

EA810 is a specially designed Burn-In Stabilization System for IC or LED mounted on 100mm or 150mm square ceramic tiles

This system has up to 1024 addressable independent source and measure channels to burn-in and test 1024 devices simultaneously. Each channel is capable of sourcing up to 10V, 2A continuously.

Copper block with water cooling channels provides up to 10KW of cooling capacity to maintain the required burn-in temperature of the device.

For LED and transistor testing, up to 2048 micro- probe pins are used to make electrical contact with the devices on the tile.

This system can perform multi-pass test (1-4 pass) burn-in/test, by indexing the tile position, in case the number of device to be tested on the tile exceeds 1024.

EL9500 : IC Analog Multi-Channel Tester

EL9500 is a family of multi-channel IC analog tester consisting of up to

A)     1280 independent VI analog source and measure channels per chassis

B)     10 independent high precision SMU channels (which can be switched into any VI channels)

C)     External input source channel (which can be switched into any of the VI channels).

Up to 16 chassis are stackable to achieve 16×1280 = 7680 IO channels, and 160 SMU System

This tester was initially designed for testing IC with multi-port IO. However, it can also be used to test transistors or diodes. All connections are using 4-wire test method.