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HSINCHU, Taiwan / PENANG, Malaysia, 9 February 2026 – Chipbond Technology Corporation, a leading global provider of semiconductor packaging and testing services, today marked the official opening of its new advanced manufacturing facility, Chipbond Technology Malaysia Sdn. Bhd., located in Valdor Industrial Park, Batu Kawan, Penang, Malaysia.

The establishment of the facility represents a significant milestone in Chipbond’s global expansion strategy, with a total investment of close to US$200 million (approximately RM800 million). The new plant strengthens Malaysia’s position within the global outsourced semiconductor assembly and test (OSAT) value chain, while reinforcing Malaysia’s role as a key hub for advanced semiconductor manufacturing.

Highlighting the broader impact of the project, Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, Chief Executive Officer of the Malaysian Investment Development Authority (MIDA), said, “This facility represents a new investment that contributes to the expansion of Malaysia’s OSAT capacity and ecosystem while further strengthening the nation’s semiconductor competitiveness. It brings deeper integration, technology transfer, and the building of local capabilities that will benefit Malaysia’s semiconductor ecosystem for years to come. Chipbond is bringing advanced OSAT expertise in wafer bumping and chip-scale packaging that requires highly skilled engineers. Your commitment to structured training programmes and university collaborations will equip Malaysians with the skills needed for complex, high-value semiconductor production. With companies like Chipbond anchoring advanced capabilities here, Malaysia is building an integrated semiconductor ecosystem where local talent and SMEs can participate meaningfully in global value chains.”

Dato’ Loo Lee Lian, Chief Executive Officer of InvestPenang (representing the Right Honourable Mr. Chow Kon Yeow, Chief Minister of Penang), stated, “Backed by more than 50 years of industrialisation and a strong foundation in OSAT, Penang has built a mature ecosystem, a skilled talent base, and a conducive business environment. Investments such as Chipbond’s are strategic in driving Penang’s shift towards advanced packaging and innovation-led growth and aligning with the National Semiconductor Strategy (NSS). We look forward to seeing strong knowledge transfer, talent upskilling, and deeper collaboration, further strengthening Penang’s position as a regional hub for advanced semiconductor packaging.”

Mr. Wu Fei Jain, Chipbond Chairman, emphasised, “This new facility represents Chipbond’s commitment in expanding our global footprint and assuring customers of stable and continuous supply. Without the supports of Malaysia government, contributions of our customers and the tireless dedications of Chipbond teams, we would not be able to achieve this challenging goal within such a compressed time frame.”

The Penang facility will offer advanced semiconductor processes, including advanced wafer bumping, wafer-level chip-scale packaging (WLCSP) and testing, with an initial capacity of 10,000 wafers and 100 million WLCSP unites per month. The plant is also equipped to support flip-chip packaging assembly and test, providing flexibility for future technology and customer requirements. Internal qualification of the facility is scheduled for completion by the end of 2025, with customer qualification commencing in the first quarter of 2026.

The establishment of Chipbond Technology Malaysia Sdn. Bhd. underscores Malaysia’s continued attractiveness to global semiconductor players and highlights the country’s growing role in supporting resilient, high-value and innovation-driven semiconductor supply chains.

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About MIDA
MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 20 overseas offices. MIDA partners with investors at every stage of their journey, supporting sustainable growth and long-term value creation for Malaysia. For more information, please visit www.mida.gov.my and follow MIDA on X, Instagram, Facebook, LinkedIn, TikTok and YouTube.

About InvestPenang
InvestPenang is the Penang State Government’s principal agency for the promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the State through foreign and local investments, including spawning viable new growth centers. To realise its objectives, InvestPenang also runs initiatives like the SMART Penang Center (providing assistance to SMEs), Penang CAT Center (for talent attraction and retention), Global Business Services (GBS) Focus Group (promoting and developing digital economy) and Penang Silicon Design @5km+ (establishing a unique and interconnected ecosystem for IC design and technology enterprises). For more information, please visit https://investpenang.gov.my/ and follow InvestPenang’s social media channels: Facebook; LinkedIn; WhatsApp Channel and TikTok.

About Chipbond
Established in 1997, Chipbond is a prominent global provider of semiconductor packaging and testing services, specialising in solutions for display driver integrated circuits. The company offers a diverse portfolio of technical processing, including bumping, assembly, and compound semiconductor manufacturing for advanced wafers. Beyond their industrial capabilities, the firm maintains a strong focus on corporate governance and environmental, social, and governance (ESG) initiatives, consistently ranking high in ethical management assessments. Investors can access comprehensive financial reporting and dividend data, while prospective employees are presented with information regarding career development and workplace benefits. Ultimately, this source serves as a central hub for stakeholders to explore the company’s technological innovations, commitment to sustainability, and strategic mission within the electronics supply chain.

For media enquiries, please contact:

MIDA
Mohd Mazlan Mokhtar (Mr.)
Director of Electrical & Electronics Division
Tel: 03- 2267 6655
Email: mazlan@mida.gov.my

InvestPenang
Elaine Cheah / Arief Ferdaus
Communications & Business Intelligence
Tel: +604-646 8833
Email: elaine@investpenang.gov.my / arief@investpenang.gov.my 

Chipbond Technology
KelvinTu(涂宗毓) 
Email: KelvinTu@chipbond.com.tw