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2月9日, 2026年

[Press Release] Chipbond Technology Strengthens Malaysia’s Advanced Semiconductor Ecosystem with New Penang Facility

Chipbond Technology Corporation, a leading global provider of semiconductor packaging and testing services, today marked the official opening of its new advanced manufacturing facility, Chipbond Technology Malaysia Sdn. Bhd., located in Valdor Industrial Park, Batu Kawan, Penang, Malaysia.
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09

Mon

February ‘26

[Press Release] Chipbond Technology Strengthens Malaysia’s Advanced Semiconductor Ecosystem with New Penang Facility

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Tue

February ‘26

[Press Release] Penang Opens Shared Lab for IC Design Validation & Characterisation to Support Statewide Semiconductor Ecosystem, Onboards Second Batch of Technology Collaborators under PSD@5KM+

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Tue

January ‘26

[Press Release] congatec Expands Penang R&D Presence, Anchoring High-value Embedded Computing Capabilities in Malaysia

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Thu

January ‘26

[Press Release] YBS International Berhad Announces Strategic Acquisition of Allied Group of Companies, Supported by EXIM Bank as Funding Partner

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Mon

January ‘26

[Press Release] Syntiant Launches New Manufacturing and R&D Campus in Penang, Doubling Production Capacity and Creating 800 High-Tech Jobs

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Mon

January ‘26

[Press Release] V-Chip Established its New IC Design Facility in Penang
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